RPI Scientists on a Roll

Researchers at Rensselaer Polytechnic Institute (RPI) might have disproven the old adage “a watched pot never boils” (Hat Tip: EcoGeek). RPI scientists have found that adding a layer of copper nanorods to the bottom of a metal vessel generates an order of magnitude increase in efficiency when boiling water. The nanorods, which are invisible to the eye but hairy-looking under magnification, could be used to cool computer chips, improve heat transfer systems, and reduce costs for industrial boiling applications. Nikhil A. Koratkar, Associate Professor in the Department of Mechanical, Aerospace, and Nuclear Engineering and head of the project, says that

“Like so many other nanotechnology and nanomaterials breakthroughs, our discovery was completely unexpected…The potential applications for this discovery are vast and exciting, and we’re eager to continue our investigations into this phenomenon.”

Koratkar’s research team has published their findings in a paper, “Nanostructure copper interfaces for enhanced boiling,” which will be published in the journal Small.